Substrate processing systems, apparatus, and methods with factory interface environmental controls

ABSTRACT

A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

RELATED APPLICATION

This application is a continuation application of and claims priorityto, U.S. patent application Ser. No. 16/112,197, filed Aug. 24, 2018,which is a continuation of, and claims priority to, U.S. patentapplication Ser. No. 14/456,631, filed Aug. 11, 2014, which claimspriority to and the benefit of U.S. Provisional Patent Application No.61/865,046, filed Aug. 12, 2013, each of which is hereby incorporated byreference herein in its entirety for all purposes.

FIELD

Embodiments relate to electronic device manufacturing, and morespecifically to equipment front end modules (EFEMs), and apparatus,systems, and methods for processing of substrates.

BACKGROUND

Electronic device manufacturing systems may include multiple processchambers arranged around a mainframe housing having a transfer chamberand one or more load lock chambers configured to pass substrates intothe transfer chamber. These systems may employ a transfer robot, whichmay be housed in the transfer chamber, for example. The transfer robotmay be a selectively compliant articulated robot arm (SCARA) robot orthe like, and may be adapted to transport substrates between the variouschambers and one or more load lock chambers. For example, the transferrobot may transport substrates from process chamber to process chamber,from load lock chamber to process chamber, and vice versa.

Processing of substrates in semi-conductor component manufacturing isgenerally carried out in multiple tools, where the substrates travelbetween the tools in substrate carriers (e.g., Front Opening UnifiedPods or FOUPs). The FOUPs may be docked to an EFEM (sometimes referredto as a “factory interface or FI”), which includes a load/unload robottherein that is operable to transfer substrates between the FOUPs andthe one or more load locks of the tool therefore allowing pass throughof substrates for processing. Existing systems may benefit fromefficiency and/or process quality improvements.

Accordingly, systems, apparatus, and methods having improved efficiencyand/or capability in the processing of substrates are desired.

SUMMARY

In one aspect, an electronic device processing system is provided. Theelectronic device processing system includes a factory interfaceincluding a factory interface chamber, a load lock apparatus coupled tothe factory interface, one or more substrate carriers coupled to thefactory interface, and an environmental control system coupled to thefactory interface and operational to monitor or control one of: arelative humidity, a temperature, an amount of O₂, or an amount of aninert gas, within the factory interface chamber.

In another aspect, a method of processing substrates within anelectronic device processing system is provided. The method includesproviding a factory interface including a factory interface chamber, oneor more substrate carriers docked to the factory interface, a load lockapparatus including one or more load lock chambers coupled to thefactory interface, and possibly an access door, and controllingenvironmental conditions in the factory interface chamber to meetenvironmental preconditions.

In yet another method aspect, a method of processing substrates withinan electronic device processing system is provided. The method includesproviding a factory interface including a factory interface chamber, oneor more substrate carriers docked to the factory interface, one or morecarrier purge chambers within the factory interface chamber, and one ormore load lock chambers coupled to the factory interface, andcontrolling environmental conditions in the factory interface chamberand the one or more carrier purge chambers.

Numerous other aspects are provided in accordance with these and otherembodiments of the invention. Other features and aspects of embodimentsof the present invention will become more fully apparent from thefollowing detailed description, the appended claims, and theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings, described below, are for illustrative purposes only andare not necessarily drawn to scale. The drawings are not intended tolimit the scope of the invention in any way.

FIG. 1 illustrates a schematic top view of an electronic deviceprocessing system including factory interface environmental controlsaccording to embodiments.

FIG. 2 illustrates a flowchart depicting a method of processingsubstrates within an electronic device processing system according toembodiments.

FIG. 3 illustrates a schematic top view of an electronic deviceprocessing system including an inert gas recirculation system accordingto embodiments.

FIG. 4 illustrates a schematic top view of another electronic deviceprocessing system including environmental controls and inert gasrecirculation according to embodiments.

FIG. 5A illustrates a cross-sectioned side view of a carrier purgeassembly according to embodiments.

FIG. 5B illustrates a front view of a carrier purge assembly accordingto embodiments.

FIG. 6 illustrates another flowchart depicting a method of processingsubstrates within an electronic device processing system according toembodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the example embodiments of thisdisclosure, which are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or like parts throughout the severalviews. Features of the various embodiments described herein may becombined with each other, unless specifically noted otherwise.

Electronic device manufacturing may desire very precise processing, aswell as rapid transport of substrates between various locations. Inparticular, existing systems may transfer substrates between FOUPs andload locks and then into processing chambers. However, existing systemsmay suffer from problems when relatively higher humidity, temperature,or other environmental factors, such as too high of an oxygen (O₂) levelare observed. In particular, exposure to relatively high humidity levelsor relatively high O₂ levels may adversely affect substrate properties.

According to one or more embodiments of the invention, electronic deviceprocessing systems adapted to provide improved substrate processing areprovided. The systems and methods described herein may provideefficiency and/or processing improvements in the processing ofsubstrates by controlling environmental conditions within a factoryinterface chamber of the factory interface. The factory interfacereceives substrates from one or more substrate carriers docked to thefactory interface (e.g., docked to a front surface thereof and aload/unload robot delivers the substrates to one or more load lockscoupled on another surface of the factory interface (e.g., a rearsurface thereof). In some embodiments, one or more environmentalparameters (e.g., a relative humidity, a temperature, an amount of O₂,or an amount of an inert gas) are monitored, and neither the one or moreload locks or any FOUP docked to the factory interface may be openedunless certain pre-conditions regarding the environment in a factoryinterface chamber of the factory interface are met.

Further details of example method and apparatus embodiments of theinvention are described with reference to FIGS. 1-6 herein.

FIG. 1 is a schematic diagram of an example embodiment of an electronicdevice processing system 100 according to one or more embodiments of thepresent invention. The electronic device processing system 100 mayinclude a mainframe housing 101 having housing walls defining a transferchamber 102. A transfer robot 103 (shown as a dotted circle) may be atleast partially housed within the transfer chamber 102. The transferrobot 103 may be configured and adapted to place or extract substratesto and from destinations via operation of the arms of the transfer robot103. Substrates as used herein shall mean articles used to makeelectronic devices or circuit components, such as silica-containingwafers, patterned wafers, or the like.

Transfer robot 103, in the depicted embodiment, may be any suitable typeof off-axis robot adapted to service the various twin chambers coupledto and accessible from the transfer chamber 102, such as the robotdisclosed in U.S. Patent Pub. No. 2010/0178147, for example. Otheroff-axis robots may be used. An off-axis robot is any robotconfiguration that can operate to extend an end effector other thanradially towards or away from a shoulder rotational axis of the robot,which is generally centered at the center of the transfer chamber 102.

The motion of the various arm components of the transfer robot 103 maybe controlled by suitable commands to a drive assembly (not shown)containing a plurality of drive motors of the transfer robot 103 ascommanded from a controller 125. Signals from the controller 125 maycause motion of the various components of the transfer robot 103.Suitable feedback mechanisms may be provided for one or more of thecomponents by various sensors, such as position encoders, or the like.

The transfer robot 103 may include arms rotatable about a shoulder axis,which may be approximately centrally located in the transfer chamber102. Transfer robot 103 may include a base that is adapted to beattached to a housing wall (e.g., a floor) forming a lower portion ofthe transfer chamber 102. However, the transfer robot 103 may beattached to a ceiling in some embodiments. The transfer robot 103 may bea dual SCARA robot or other type of dual robot adapted to service twinchambers (e.g., side-by-side chambers). Other types of process chamberorientations, as well as transfer robots may be used.

The rotation of the arm components of the transfer robot 103 may beprovided by any suitable drive motor, such as a conventional variablereluctance or permanent magnet electric motor. Arms may be adapted to berotated in an X-Y plane relative to the base. Any suitable number of armcomponents and end effectors adapted to carry the substrates may beused.

Additionally, the drive assembly of the transfer robot 103 may includeZ-axis motion capability in some embodiments. In particular, the motorhousing may be restrained from rotation relative to an outer casing by amotion restrictor. Motion restrictor may be two or more linear bearingsor other type of bearing or slide mechanisms that function to constrainrotation of the motor housing relative to the outer casing, yet allowZ-axis (vertical) motion of the motor housing and connected arms alongthe vertical direction. The vertical motion may be provided by avertical motor. Rotation of the vertical motor may operate to rotate alead screw in a receiver coupled to or integral with motor housing. Thisrotation may vertically translate the motor housing, and, thus, thearms, one or more attached end effectors, and the substrates supportedthereon. A suitable seal may seal between the motor housing and the basethereby accommodating the vertical motion, and retaining a vacuum withinthe transfer chamber 102 in some embodiments.

The transfer chamber 102 in the depicted embodiment may be generallysquare or slightly rectangular in shape and may include a first facet102A, second facet 102B opposite the first facet 102A, a third facet102C, and a fourth facet 102D opposite the third facet 102C. Thetransfer robot 103 may be preferably adept at transferring and/orretracting dual substrates at a same time into the chamber sets. Thefirst facet 102A, second facet 102B, a third facet 102C, and fourthfacet 102D may be generally planar and entryways into the chamber setsmay lie along the respective facets. However, other suitable shape ofthe mainframe housing 101 and numbers of facets and processing chambersis possible.

The destinations for the transfer robot 103 may be a first processchamber set 108A, 108B, coupled to the first facet 102A and which may beconfigured and operable to carry out a process on the substratesdelivered thereto. The process may be any suitable process such asplasma vapor deposition (PVD) or chemical vapor deposition (CVD), etch,annealing, pre-clean, metal ore metal oxide removal, or the like. Otherprocesses may be carried out on substrates therein.

The destinations for the transfer robot 103 may also be a second processchamber set 108C, 108D that may be generally opposed from the firstprocess chamber set 108A, 108B. The second process chamber set 108C,108D may be coupled to the second facet 102B and may be configured andadapted to carry out any suitable process on the substrates, such as anyof the processes mentioned above. Likewise, the destinations for thetransfer robot 103 may also be a third process chamber set 108E, 108Fthat may be generally opposed from the load lock apparatus 112 coupledto the third facet 102C. The third process chamber set 108E, 108F may beconfigured and adapted to carry out any suitable process on thesubstrates, such as any of the processes mentioned above.

Substrates may be received into the transfer chamber 102 from a factoryinterface 114, and also exit the transfer chamber 102, to the factoryinterface 114, through the load lock apparatus 112 that is coupled to asurface (e.g., a rear wall) of the factory interface 114. The load lockapparatus 112 may include one or more load lock chambers (e.g., loadlock chambers 112A, 112B, for example). Load lock chambers 112A, 112Bthat are included in the load lock apparatus 112 may be single waferload locks (SWLL) chambers, or multi-wafer chambers. The load lockapparatus 112 may, in some embodiments, include a heatingplatform/apparatus to heat the substrate to greater than about 200degrees C., such that a degassing process may be carried out on incomingsubstrates before they are passed into the transfer chamber 102 from thefactory interface 114.

The factory interface 114 may be any enclosure having sidewall surfaces(including front, rear, two side walls, atop, and a bottom) forming afactory interface chamber 114C. One or more load ports 115 may beprovided on surfaces (e.g., front surfaces) of the factory interface 114and may be configured and adapted to receive one or more substratecarriers 116 (e.g., front opening unified pods or FOUPs) thereat.

Factory interface 114 may include a suitable load/unload robot 117(shown dotted) of conventional construction within the factory interfacechamber 114C thereof. The load/unload robot 117 may be configured andoperational, once the doors of the substrate carriers 116 are opened, toextract substrates from the one or more substrate carriers 116 and feedthe substrates through the factory interface chamber 114C and into theone or more load lock chambers 112A, 112B as may be provided in the loadlock apparatus 112. Any suitable construction of the load lock apparatus112 allowing transfer of substrates between the transfer chamber 102 andthe factory interface chamber 114C may be used.

The transfer chamber 102 may include slit valves 134 at aningress/egress to the various process chambers 108A through 108F.Likewise, load lock chambers 112A, 112B in the one or more load lockapparatus 112 may include inner and outer load lock slit valves 136,138. Slit valves 134, 136, 138 are adapted to open and close whenplacing or extracting substrates to and from the various processchambers 108A-108F and load lock chambers 112A, 112B. Slit valves 134,136, 138 may be of any suitable conventional construction, such asL-motion slit valves.

In the depicted embodiment, the factory interface chamber 114C may beprovided with environmental controls providing anenvironmentally-controlled atmosphere. In particular, environmentalcontrol system 118 is coupled to the factory interface 114 andoperational to monitor and/or control environmental conditions withinthe factory interface chamber 114C. In some embodiments, and at certaintimes, the factory interface chamber 114C may receive an insert gastherein, such as Argon (Ar), Nitrogen (N₂), or helium (He), from aninert gas supply 118A. In other embodiments, or at other times, air(e.g., filtered air) may be provided from an air supply 118B.

In more detail, the environmental control system 118 may control atleast one of: 1) relative humidity (RH), 2) temperature (T), 3) anamount of O₂, or 4) an amount of inert gas, within the factory interfacechamber 114C. Other environmental conditions of the factory interfacemay be monitored and/or controlled, such as gas flow rate or pressure orboth.

In some embodiments, environmental control system 118 includes acontroller 125. Controller 125 may include suitable processor, memory,and electronic components for receiving inputs from various sensors andcontrolling one or more valves. Environmental control system 118 may, inone or more embodiments, monitor relative humidity (RH) by sensing RH inthe factory interface chamber 114C with a relative humidity sensor 130that is configured and adapted to sense relative humidity (RH). Anysuitable type of relative humidity sensor 130 may be used, such as acapacitive-type sensor. In some embodiments, the controller 125 monitorsRH, and when a measured RH value provided to the controller 125 is abovea predefined RH threshold value, carrier doors 116D of the one or moresubstrate carriers 116 coupled to load ports of the factory interface114 stay closed. Carrier doors 116D of the substrate carriers 116 may beopened when the measured RH value falls below the predefined RHthreshold value. The RH may be lowered by flowing a suitable amount ofan inert gas from the inert gas supply 118A of the environmental controlsystem 118 into the factory interface chamber 114C. As described herein,the inert gas from the inert gas supply 118A may be argon, N₂, helium,or mixtures thereof. A supply of dry nitrogen gas (N₂) may be quiteeffective. Compressed bulk inert gases having low H₂O levels (e.g., lessthan 5 ppm) may be used as the inert gas supply 118A in theenvironmental control system 118.

In another aspect, the environmental control system 118 measures arelative humidity value with the relative humidity sensor 130, and ifthe measured relative humidity value is above a pre-defined referencerelative humidity value, an outer load lock slit valve 138 of the one ormore load lock apparatus 112 coupled to the factory interface 114 stayclosed. The one or more load lock apparatus 112 may remain closed untilthe relative humidity falls below the pre-defined reference relativehumidity value. As discussed above, the RH may be lowered by a controlsignal from the controller 125 to the environmental control system 118initiating a flow of a suitable amount of an inert gas from the inertgas supply 118A into the factory interface chamber 114C. In one or moreembodiments, the pre-defined reference relative humidity value may beless than 1000 ppm moisture, less than 500 ppm moisture, or even lessthan 100 ppm moisture, depending upon the level of moisture that istolerable for the particular process being carried out in the electronicdevice processing system 100.

In some embodiments, the environmental control system 118 of theelectronic device processing system 100 may include an air supply 118Bcoupled to the factory interface chamber 114C. The air supply 118B maybe coupled by suitable conduits and one or more valves to the factoryinterface chamber 114C. The environmental control system 118 may includean oxygen sensor 132 that is configured and adapted to sense a level ofoxygen (O₂) within the factory interface chamber 114C. In oneembodiment, when a person seeks to enter the factory interface chamber114C, and initiates an entry request, the controller 125 of theenvironmental control system 118 may initiate a flow of air from the airsupply 118B such that at least some of the inert gas environment isexhausted and replaced with air. When a level of oxygen detected withinthe factory interface chamber 114C reaches a suitable pre-defined O₂level, a door interlock 140 keeping an access door 142 closed may beunlatched to allow the access door 142 to be opened (as shown dotted)and thus allow the person access to the factory interface chamber 114C.

In some embodiments, the factory interface 114 of the electronic deviceprocessing system 100 may include a cooling station 144. The coolingstation 144 may include one or more platforms, shelves, or other supportfeatures upon which one or more substrates 145 exiting the load lockapparatus 112 may rest and be cooled before insertion into a substratecarrier 116.

In one or more embodiments, a temperature sensor 135 that is configuredand adapted to sense a temperature within the factory interface chamber114C may be used. In some embodiments, the temperature sensor 135 may beplaced close to the substrate 145. In some embodiments, the temperaturesensor 135 may be a directional sensor, such as a laser sensor that maybe used to determine an extent to which the substrate 145 has beencooled. This input from the temperature sensor 135 may be used todetermine when the transfer from the cooling station 144 may occur.

In the depicted embodiments herein, the controller 125 may be anysuitable controller having suitable processor, memory, and peripheralcomponents adapted to receive control inputs from the various sensors(e.g., relative humidity sensor 130, oxygen sensor 132, and/ortemperature sensor 135) and execute a closed loop or other suitablecontrol scheme. In one embodiment, the control scheme may change a flowrate of a gas being introduced into the factory interface chamber 114C.In another, the control scheme may determine when to transfer substrates145 into the factory interface chamber 114C.

Referring now to FIG. 2, one method of processing substrates within anelectronic device processing system (e.g., electronic device processingsystem 100) will be described. The method 200 includes, in 202,providing a factory interface (e.g., factory interface 114) having afactory interface chamber (e.g., factory interface chamber 114C) and oneor more substrate carriers (e.g., substrate carriers 116) docked to thefactory interface, and one or more load lock chambers (e.g., load lockchambers 112A, 112B) coupled to the factory interface.

The method 200 includes, in 204, controlling environmental conditions tomeet environmental preconditions. For example, controlling environmentalconditions to meet environmental preconditions may take place beforeopening any one of the one or more substrate carrier doors (e.g.,carrier doors 116D) or the one or more load lock chambers (e.g., openingthe outer load lock slit valves 138 of the load lock chambers 112A,112B).

According to one or more embodiments of the invention, one or more ofthe carrier doors 116D and the outer load lock slit valves 138 may beopened when certain environmental preconditions are met. For example,environmental preconditions may be met, in one example, when a measuredrelative humidity (RH) level in the factory interface chamber 114C fallsbelow a predefined relative humidity level threshold (e.g., less than1000 ppm moisture, less than 500 ppm moisture, less than 100 ppmmoisture, or even lower). Other suitable thresholds may be useddepending on the processing taking place.

In order to meet, i.e., fall below, previously-failed environmentalpreconditions, an inert gas (e.g., dry N₂ gas or other inert gas) may beflowed into the factory interface chamber 114C from the inert gas supply118A. The inert gas supply 118A may be a suitable canister of inert gasunder pressure, for example. Flow rates of inert gas provided into thefactory interface chamber 114C may be monitored by a suitable flowsensor (not shown) on a delivery line and/or pressure sensor 133 locatedwithin the factory interface chamber 114C, or both. Flow rates of 400SLM or more may be provided by adjusting a valve coupled to the inertgas supply 118A responsive to control signals provided by controller125. Pressures of greater than about 500 Pa may be maintained within thefactory interface chamber 114C. Flow of inert gas (e.g., N₂ or otherinert gas) into the factory interface chamber 114C is operative to lowerthe relative humidity (RH) level, and the carrier door 116D and/or theouter load lock slit valves 138 of the one or more load lock chambers112A, 112B may be opened when the relative humidity threshold value ifmet. This helps to ensure that substrates within the substrate carriers116 that are opened, any load lock chambers 112A, 112B that are opened,as well as any substrates passing through the factory interface chamber114C are exposed to only a suitably low humidity environment.

In another example, environmental preconditions may be met, for example,when a measured oxygen (O₂) level in the factory interface chamber 114C,as sensed by oxygen sensor 132, falls below a predefined oxygenthreshold level (e.g., less than 50 ppm O₂, less than 10 ppm O₂, lessthan 5 ppm O₂, or even less than 3 ppm O₂, or even lower). Othersuitable oxygen level thresholds may be used, depending on theprocessing taking place. If the predefined oxygen threshold level in thefactory interface chamber 114C is not met, the controller 125 willinitiate a control signal to the valve coupled to the inert gas supply118A and flow inert gas into the factory interface chamber 114C untilthe predefined oxygen threshold level is met, as determined by thecontroller 125. When the predefined oxygen threshold level is met, thecarrier door 116D and/or the outer load lock slit valves 138 of the oneor more load lock chambers 112A, 112B may be opened. This helps toensure that substrates within the substrate carriers 116 that areopened, any load lock chambers 112A, 112B that are opened, as well asany substrates passing through the factory interface chamber 114C areexposed to relatively low oxygen levels.

In another example, environmental preconditions may be met, for example,when a measured temperature level in the factory interface chamber 114C,such as a temperature of substrates 145 in the cooling station 144, assensed by temperature sensor 135, fall below a predefined temperaturethreshold level (e.g., less than 100 degrees C., or even lower) Once thepredefined temperature threshold level is met, cooled substrates 145 maybe loaded into a substrate carrier 116 for transport. Cooling station144 may include cooling platforms, inert gas flow, or combinationsthereof.

In some embodiments, an access door 142 of the factory interface 114 maybe opened only when certain environmental preconditions are met. Forexample, the environmental preconditions may include attaining an oxygenvalue in the factory interface chamber 114C that is above apredetermined oxygen level value that has been determined to be safe.The oxygen level value may be sensed by the oxygen sensor 132, forexample. A door interlock 140 (e.g., an electromechanical lock) mayprevent the access door 142 from being opened unless the controller 125determines that the predetermined oxygen level that is deemed to be safehas been met, and sends a signal to open the door interlock 140. Iffailed, the environmental preconditions may be met by flowing air fromthe air supply 118B into the factory interface chamber 114C via acontrol signal to a valve and flowing inert gas out of the factoryinterface chamber 114C through an exhaust conduit 150. Air supply 118Bmay be a supply of filtered air provided by a fan or air pump.

As is shown in FIG. 3, another embodiment of electronic deviceprocessing system 300 is provided (the mainframe housing, processingchambers, and load lock chambers not shown for clarity). Theenvironmental control system 318 of the electronic device processingsystem 300 may include the components previously mentioned, but may alsoinclude inert gas recirculation. In particular, the inert gas may berecycled and reused in order to provide more efficient environmentalcontrols of the factory interface 114. For example, in the depictedembodiment, the inert gas from the factory interface chamber 114C may beexhausted in an exhaust conduit 350 from the factory interface chamber114C, filtered through a filter 352, which may be a moisture-reducingfilter and also may filter particulates, and then may be pumped backinto the inert gas supply 118A by a pump 354. The filter 352 may be amoisture absorbent filter, which may include multiple layers ofabsorbent materials. However, other mechanisms or devices for reducingmoisture content, such as condensers or other moisture removers may beused. In some embodiments, the inert gas may also be cooled.

Inert gas consumption may be monitored in some embodiments, such as byuse of a flow sensor (not shown) in the delivery line from the inert gassupply 118A and the measured flow rate may be correlated to attaining aspecified RH value within the factory interface chamber 114C. If theamount of inert gas consumption is outside of a pre-established limit,then a leak in the factory interface chamber 114C may be flagged, suchas by an message to an operator, a visual indicator, an alarm, or thelike. Optionally, if a pressure within the factory interface chamber114C is outside (e.g., below) a pre-established limit, then a leak inthe factory interface chamber 114C may be flagged, as above.

FIG. 4 illustrates another embodiment of electronic device processingsystem 400 including an environmental control system 418. In thisembodiment, the environmental control system 418 includes a combinationof environmental control of the factory interface chamber 414C coupledwith environmental control of one or more carrier purge chambers 454.Otherwise, this embodiment is similar to the FIG. 3 embodiment, exceptthat a carrier purge system 452 is provided.

Carrier purge system 452, which may be capable of independent usageapart from the environmental control of the factory interface chamber414C, includes a gas purge system 457. Gas purge system 457 includes theinert gas supply (e.g., inert gas supply 118A) and a plurality of supplyconduits and valves coupled thereto. The plurality of supply conduitsand valves of the gas purge system 457 supply inert gas to the carrierpurge chambers 454 at certain times responsive to control signals fromthe controller 425. For example, the supply of inert gas may be providedto a carrier purge chamber 454 just after opening a carrier door 116D ofa substrate carrier 116 in order to purge the environment 562 (FIG. SA)of the substrate carrier 116 and the carrier purge chamber 454 to meetcertain environmental preconditions before transferring substrates 545from the substrate carrier 116 into the factory interface chamber 114C.

The details and the components and operation of the carrier purge system452 of the factory interface 414 will now be described with reference toFIGS. 4 and SA-SB. Carrier purge system 452 includes a carrier purgehousing 556 for each substrate carrier 116 including purge capability.Such purge capability may be included for some or all of the substratecarriers 116. Carrier purge housing 556 forms a part of each carrierpurge chamber 454. Carrier purge housing 556 may seal against a surfaceof an inside wall 558 of the factory interface 114 (e.g., a front wall)and form the carrier purge chamber 454. Carrier purge housing 556remains sealed against the surface of an inside wall 558 as the carrierdoor 116D is opened. Any suitable seal may be used, such as a gasket orO-ring.

The carrier purge system 452 is adapted to receive the environment 562of the substrate carrier 116 into a carrier purge chamber 454 uponopening a carrier door 116D thereof via operation of a door opener 565and the door retraction mechanism 567. Once the carrier door 116D isopened, purging of the carrier purge chamber 454 may take place so thatthe environment 562, which may contain undesirable levels of O₂ ormoisture, does not enter the factory interface chamber 114C. Purging ofthe carrier purge chamber 454 continues until certain predefinedenvironmental conditions are met. Purging may be provided via inert gasprovided from the gas purge system 457. One or more diffusers 559 may beincluded at the exits from a conduit 557C of the gas purge system 457supplying inert gas into the carrier purge chamber 454.

The environmental conditions may be based upon a predefined relativehumidity RH threshold level and/or a predefined O₂ threshold level, forexample. For example, a relative humidity of less than a predefined RHthreshold level (e.g., less than about 5% moisture-less than about50,000 ppm) may be sought before retracting the carrier purge housing556 away from the inside wall 558 and lowering the carrier purge housing556 to allow the load/unload robot 117 to access and remove thesubstrates 545. If the oxygen level is the environmental criteria, thenan O₂ threshold level of less than a predefined threshold level (e.g.,less than about 500 ppm O₂) may be sought before retracting and loweringthe carrier purge housing 556. Other predefined threshold levels may beused.

In order to attain one or both of these threshold levels, a chamberrelative humidity sensor 576 and/or a chamber oxygen sensor 578 may beprovided that interconnect with the controller 425. Chamber relativehumidity sensor 576 and/or a chamber oxygen sensor 578 may be on thecarrier purge housing 556, in a chamber exhaust conduit 580 within thefactory interface chamber 114C, or even outside of the factory interface114, such as on the chamber exhaust conduit 580. Purging with inert gasfrom the gas purge system 457 may continue until the environmentalpreconditions are met. In some embodiments, purging for a certainpre-established time or volume, based upon previously-performedexperiments, may be used to ensure that the environmental preconditionsare met.

In operation, the carrier purge housing 556 surrounds a door opener 565.The door opener 565 is adapted to be retractable within an interior ofthe carrier purge housing 556. Retraction of the door opener 565 may beby a door retraction mechanism 567, such as a linear slide 569 and arack and pinion mechanism 570. Rack and pinion mechanism 570 may includea rack 572, pinion 574, and drive motor 575 coupled to the pinion 574.Drive signals from the controller 425 to the drive motor 575 causesretraction of the carrier door 116D and mixing of the environment 562with that in the carrier purge chamber 454. Any door unlock and graspmechanism 573 may be used on the door opener 565 to grasp and open thecarrier door 116D, as is conventional.

Retraction from and closure (e.g., sealing) against the inside wall 558by the carrier purge housing 556 may be provided by a housing drivesystem 581 and slide mechanism 582. Slide mechanism 582 allows linearmotion towards and away from the inside wall 558 relative to a supportframe 584 that attaches to an elevator 585. Housing drive system 581 mayinclude a suitable motor and transmission mechanism to cause the motiontowards and away from the inside wall 558. In the depicted embodiment, arack and pinion mechanism is shown, including housing rack 586 coupledto the carrier purge housing 556, housing pinion 588, and housing drivemotor 589. Driving the housing drive motor 589 translates the carrierpurge housing 556 horizontally in or out relative to the elevator 585and the inside wall 558.

Lowering of the carrier purge housing 556 may be provided by theelevator 585. Elevator 585 may include any suitable mechanismconstruction for providing vertical motion of the carrier purge housing556. For example, as depicted, the elevator 585 includes a linearbearing assembly 590 including a bearing slide 591, rail 592, andmounting blocks 593. Mounting blocks 593 may fasten the rail 592 to theinside wall 558. Bearing slide 591 may fasten to a vertical actuator594. A Vertical actuator rail 595 may also be provided, and may befastened to the inside wall 558. Actuation of the vertical actuator 594causes vertical motion relative to the vertical actuator rail 595,raising or lowering the support frame 584 and the coupled carrier purgehousing 556. Vertical actuator 594 may be any suitable actuator type,such as pneumatic, electrical, or the like. Thus, it should be apparentthat operation of the door grasp and unlock mechanism 573 grasps andopens the carrier door 116D, the rack and pinion mechanism 570 retractsthe carrier door 116D, the carrier purge system 452 purges the carrierpurge chamber 454 to meet environmental preconditions, the housing drivesystem 581 retracts the carrier purge housing 556, and the elevator 585lowers the carrier purge housing 556 and carrier door 116D so that theload/unload robot 117 may access the substrates 545 in the substratecarrier 116.

Again referring to FIG. 4, the environmental control system 418 mayinclude the components previously mentioned, and may also include inertgas recirculation. For example, the inert gas may be exhausted in anexhaust conduit 450 from the factory interface chamber 414C, andfiltered through filter 352, which may be a moisture-reducing filter,but may also filter particulates, and may be of the type discussedabove. In this embodiment, the filtered inert gas may be recirculateddirectly back into the factory interface chamber 414C.

For example, in the depicted embodiment, a portion of the exhaustcirculation route may be through the chamber door 442. For example, theexhaust from the factory interface chamber 414C may enter into a channel443 (e.g., a duct) formed in the chamber door 442. Channel 443 may havean entrance from the factory interface chamber 414C at or near a bottomof the chamber door 442, and progress to above the filter 352, which maybe within an upper part of the factory interface chamber 414C in someembodiments. Thus, channel 443 may be part of the exhaust conduit 450. Adoor similar to chamber door 442 including an internal channel, likechannel 443, may be provided on the other side of the factory interface414 in some embodiments.

Referring now to FIG. 6, another method of processing substrates withinan electronic device processing system (e.g., electronic deviceprocessing system 400) will be described. The method 600 includes, in602, providing a factory interface (e.g., factory interface 414) havinga factory interface chamber (e.g., factory interface chamber 414C), oneor more substrate carriers (e.g., substrate carriers 116) docked to thefactory interface, one or more carrier purge chambers (e.g., carrierpurge chambers 454) within the factory interface chamber, and one ormore load lock chambers (e.g., load lock chambers 112A, 112B of loadlock apparatus 112) coupled to the factory interface.

The method 600 includes, in 604, controlling environmental conditionswithin the factory interface (e.g., factory interface 414) and withinthe one or more carrier purge chambers (e.g., carrier purge chambers454). Controlling environmental conditions within the factory interfacemay include meeting environmental preconditions in the factory interfacechamber before allowing the opening any one of the one or more substratecarrier doors (e.g., carrier doors 116D) or any one of the one or moreload lock chambers (e.g., the outer load lock slit valves 138 of theload lock chambers 112A, 112B) Controlling environmental conditionswithin the one or more carrier purge chambers (e.g., carrier purgechambers 454) may include meeting certain environmental preconditions(e.g., on RH threshold level or an O₂ threshold level) before unsealingvia retraction and lowering the carrier purge housing 556, as discussedabove. Providing such environmental controls in accordance withembodiments of the invention may reduce exposure of the substrates 545exiting the substrate carriers 116 or exiting the load lock chambers112A, 112B after processing to environmental conditions that may bedetrimental, such as relatively humid environments or environments withrelatively high O₂ levels.

The foregoing description discloses only example embodiments of theinvention. Modifications of the above-disclosed apparatus, systems andmethods which fall within the scope of the invention will be readilyapparent to those of ordinary skill in the art. Accordingly, while thepresent invention has been disclosed in connection with exampleembodiments, it should be understood that other embodiments may fallwithin the scope of the invention, as defined by the following claims.

What is claimed is:
 1. A factory interface for an electronic deviceprocessing system, comprising: a factory interface chamber; a door thatprovides maintenance access to the factory interface chamber; one ormore environmental condition sensors configured to detect one or moreenvironmental conditions within the factory interface chamber; an inertgas supply conduit coupled to an inert gas supply that is configured tostore an inert gas under pressure, wherein the inert gas supply conduitis configured to supply the inert gas from the inert gas supply into thefactory interface chamber; a recirculation conduit to exhaust the inertgas from the factory interface chamber, wherein at least a portion ofthe recirculation conduit is routed through the door that providesmaintenance access to the factory interface chamber; a flow rate sensorconfigured to detect a flow rate of the inert gas flowed into thefactory interface chamber; and a controller including at least aprocessor and a memory, wherein the controller is coupled to the one ormore environmental condition sensors and the flow rate sensor, andwherein the controller is to: control an amount of inert gas deliveredinto the factory interface chamber in view of the flow rate of the inertgas detected by the flow rate sensor; adjust the one or moreenvironmental conditions within the factory interface chamber by flowinginert gas out of the factory interface chamber via the recirculationconduit, wherein adjusting the valve and flowing the inert gas out ofthe factory interface chamber is further to cause the one or moreenvironmental conditions of the factory interface chamber to satisfy afactory interface environment criterion, and wherein the inert gas is atleast partially recirculated back into the factory interface chamber byway of the recirculation conduit; and responsive to determining that avalue of an oxygen condition of the one or more environmental conditionsexceeds a predetermined value, enabling the door that providesmaintenance access to the factory interface chamber to be opened.
 2. Thefactory interface of claim 1, wherein at least a portion of therecirculation conduit is coupled to the factory interface chamber,wherein the controller is further to: recirculate the inert gasexhausted from the factory interface chamber back into the factoryinterface chamber.
 3. The factory interface of claim 1 wherein the oneor more environmental condition sensors comprises at least one of atemperature sensor, a humidity sensor or an O₂ sensor, and wherein thecontroller is further to: monitor readings of at least one of thetemperature sensor, the humidity sensor or the O₂ sensor; and adjust theone or more environmental conditions in the factory interface chamberbased on the readings.
 4. The factory interface of claim 1, wherein theone or more environmental condition sensors are configured to measure atleast one of pressure, moisture, or O₂ level in the factory interfacechamber; wherein the controller is further to control the amount of theinert gas delivered into the factory interface chamber based on at leastone of the pressure, the moisture or the O₂ level.
 5. The factoryinterface of claim 1, wherein the one or more environmental conditionsensors are configured to measure at least one of pressure, moisture, orO₂ level in the factory interface chamber; wherein the controller is tocontrol the amount of the inert gas exhausted out of the factoryinterface chamber based on at least one of the pressure, the moisture orthe O₂ level.
 6. The factory interface of claim 1, further comprising: afirst valve to control the flow rate of the inert gas that is deliveredinto the factory interface chamber; and a second valve to control theflow of the inert gas that is flowed out of the factory interfacechamber via the recirculation conduit; wherein the controller is toadjust a pressure of the factory interface chamber based on adjusting atleast one of the first valve or the second valve, causing a pressure ofthe factory interface chamber to be adjusted.
 7. The factory interfaceof claim 1, further comprising: a filter in series with therecirculation conduit.
 8. The factory interface of claim 7, wherein thefilter is configured to filter at least one of particulates or moisture.9. The factory interface of claim 1, further comprising: a valve tocontrol the flow rate of the inert gas that is delivered into thefactory interface chamber.
 10. The factory interface of claim 1, furthercomprising: a valve to control a flow of the inert gas that is flowedout of the factory interface chamber via the recirculation conduit. 11.The factory interface of claim 1, further comprising: a filter connectedto the recirculation conduit; and a pump to pump the inert gas that hasbeen exhausted out of the factory interface chamber back into the inertgas supply coupled to the inert gas supply conduit.
 12. The factoryinterface of claim 1, further comprising: a cooling station coupled tothe factory interface chamber.
 13. The factory interface of claim 1,wherein the inert gas supply conduit and the recirculation conduit areincluded as part of an inert gas recirculation system of the factoryinterface, and wherein the inert gas recirculation system is configuredto recirculate the inert gas exhausted from the factory interfacechamber back into the factory interface chamber.